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STD40NF06LZ Datasheet(PDF) 2 Page - STMicroelectronics |
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STD40NF06LZ Datasheet(HTML) 2 Page - STMicroelectronics |
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2 / 8 page ![]() STD40NF06LZ 2/8 THERMAL DATA (#) When Mounted on 1 inch2 FR-4 board, 2 oz Cu. ELECTRICAL CHARACTERISTICS (Tcase = 25 °C unless otherwise specified) OFF ON (*) DYNAMIC Rthj-case Rthj-PCB Tl Thermal Resistance Junction-case Thermal Resistance Junction-PCB (#) Maximum Lead Temperature For Soldering Purpose Max Max 1.5 50 300 °C/W °C/W °C Symbol Parameter Test Conditions Min. Typ. Max. Unit V(BR)DSS Drain-source Breakdown Voltage ID = 250 µA, VGS = 0 60 V IDSS Zero Gate Voltage Drain Current (VGS = 0) VDS = Max Rating VDS = Max Rating TC = 125°C 1 50 µA µA IGSS Gate-body Leakage Current (VDS = 0) VGS = ± 16 V ±10 µA Symbol Parameter Test Conditions Min. Typ. Max. Unit VGS(th) Gate Threshold Voltage VDS = VGS ID = 250 µA 1V RDS(on) Static Drain-source On Resistance VGS = 5 V ID = 20 A VGS = 10 V D = 20 A 0.030 0.025 Ω Ω Symbol Parameter Test Conditions Min. Typ. Max. Unit gfs (*) Forward Transconductance VDS = 15 V ID = 20 A 25 S Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS = 25V, f = 1 MHz, VGS = 0 1360 302 115 pF pF pF |
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