Package information

EMIF02-MIC03M6

4/10

3

Package information

●

Epoxy meets UL94, V0

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at

www.st.com.

Table 3.

Micro QFN 1.45 x 1.00 6L dimensions

Ref.

Dimensions

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

A

0.50

0.55

0.60

0.020 0.022 0.024

A1

0.00

0.02

0.05

0.000 0.001 0.002

b

0.18

0.25

0.30

0.007 0.010 0.012

D

1.45

0.057

E

1.00

0.039

e

0.50

0.020

K

0.20

0.008

L

0.30

0.35

0.40

0.012 0.014 0.016

Figure 8.

Footprint in mm [inches]

Figure 9.

Marking

E

D

A

A1

e

b

k

L

N

1

1

2

2

0.50

[0.020]

0.25

[0.010]

0.60

[0.023]

0.30

[0.012]

1.60

[0.063]

Dot : Pi n 1 Identification

L