Package mechanical data

L6933H1.2

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Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect . The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

Table 8. SO-8 mechanical data

Dim.

mm.

inch

Min

Typ

Max

Min

Typ

Max

A

1.35

1.75

0.053

0.069

A1

0.10

0.25

0.004

0.010

A2

1.10

1.65

0.043

0.065

B

0.33

0.51

0.013

0.020

C

0.19

0.25

0.007

0.010

D

(1)

1.

Dimensions D does not include mold flash, protru-sions or gate burrs. Mold flash, potrusions or gate burrs

shall not exceed 0.15mm (.006inch) in total (both side).

4.80

5.00

0.189

0.197

E

3.80

4.00

0.15

0.157

e

1.27

0.050

H

5.80

6.20

0.228

0.244

h

0.25

0.50

0.010

0.020

L

0.40

1.27

0.016

0.050

k

0° (min.), 8° (max.)

ddd

0.10

0.004

Figure 9.

Package dimensions