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STSJ3NM50 Datasheet(PDF) 3 Page - STMicroelectronics

Part # STSJ3NM50
Description  N-CHANNEL 500V - 2.5ohm - 3A PowerSO-8 Zener-Protected MDmesh??POWER MOSFET
PDF  8 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STSJ3NM50 Datasheet(HTML) 3 Page - STMicroelectronics

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STSJ3NM50
ELECTRICAL CHARACTERISTICS (CONTINUED)
SWITCHING ON
SWITCHING OFF
SOURCE DRAIN DIODE
Note: 1. When mounted on 1inch² FR4 Board, 2oz of Cu, t
≤ 10 sec.
2. Pulse width limited by safe operating area
3. ISD<3.3A, di/dt<400A/µs, VDD<V(BR)DSS, TJ<TJMAX
4. Pulsed: Pulse duration = 400 µs, duty cycle 1.5 %
GATE-SOURCE ZENER DIODE
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES
The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s
ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be
applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and
cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the
usage of external components.
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
td(on)
Turn-on Delay Time
VDD = 250 V, ID = 1.5 A
RG = 4.7Ω VGS = 10 V
(see test circuit, Figure 3)
7ns
tr
Rise Time
10
ns
Qg
Qgs
Qgd
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
VDD = 400 V, ID = 3 A,
VGS = 10 V
5.5
2.5
2.4
nC
nC
nC
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
tr(Voff)
tf
tc
Off-Voltage Rise Time
Fall Time
Cross-Over Time
VDD = 480 V, ID = 3 A,
RG =4.7Ω, VGS = 10 V
(see test circuit, Figure 3)
8
9
15
ns
ns
ns
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
ISD
Source-drain Current
3
A
ISDM (2)
Source-drain Current (pulsed)
12
A
VSD (4)
Forward On Voltage
ISD = 3 A, VGS = 0
1.5
V
trr
Qrr
IRRM
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
ISD = 3, di/dt = 100A/µs,
VDD = 100 V, Tj = 25°C
(see test circuit, Figure 5)
210
790
7.5
ns
nC
A
trr
Qrr
IRRM
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
ISD = 3, di/dt = 100A/µs,
VDD = 100 V, Tj = 150°C
(see test circuit, Figure 5)
282
1.1
7.7
ns
nC
A
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
BVGSO
Gate-Source Breakdown
Voltage
Igs=± 1mA (Open Drain)
30
V



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