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STW16NB60 Datasheet(PDF) 3 Page - STMicroelectronics |
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STW16NB60 Datasheet(HTML) 3 Page - STMicroelectronics |
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3 / 8 page ![]() 3/8 STW16NB60 Safe Operating Area Thermal Impedance ELECTRICAL CHARACTERISTICS (CONTINUED) SWITCHING ON SWITCHING OFF SOURCE DRAIN DIODE Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %. 2. Pulse width limited by safe operating area. Symbol Parameter Test Conditions Min. Typ. Max. Unit td(on) Turn-on Delay Time Rise Time VDD = 300V, ID =8 A RG = 4.7Ω,VGS = 10V (see test circuit, Figure 3) 35 ns tr 16 ns Qg Total Gate Charge VDD = 480V, ID =16 A, VGS =10V,RG =4.7Ω 80 105 nC Qgs Gate-Source Charge 19.5 nC Qgd Gate-Drain Charge 35 nC Symbol Parameter Test Conditions Min. Typ. Max. Unit tr(Voff) Off-voltage Rise Time VDD =480V, ID =16 A, RG = 4.7Ω, VGS =10V (see test circuit, Figure 5) 15 ns tf Fall Time 12 ns tc Cross-over Time 30 ns Symbol Parameter Test Conditions Min. Typ. Max. Unit ISD Source-drain Current 16 A ISDM (2) Source-drain Current (pulsed) 64 A VSD (1) Forward On Voltage ISD =16 A,VGS =0 1.6 V trr Reverse Recovery Time ISD = 16 A, di/dt = 100 A/µs, VDD = 100V, Tj = 150°C (see test circuit, Figure 5) 800 ns Qrr Reverse Recovery Charge 11 µC IRRM Reverse Recovery Current 27 A |
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