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SFH6325 Datasheet(PDF) 2 Page - Vishay Siliconix

Part # SFH6325
Description  High Speed Optocoupler, Dual Channel, 1 MBd, Transistor Output
PDF  8 Pages
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Manufacturer  VISHAY [Vishay Siliconix]
Direct Link  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

SFH6325 Datasheet(HTML) 2 Page - Vishay Siliconix

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For technical questions, contact: optocoupler.answers@vishay.com
Document Number: 83679
2
Rev. 1.5, 10-Jan-08
SFH6325/SFH6326
Vishay Semiconductors
High Speed Optocoupler, Dual
Channel, 1 MBd,
Transistor Output
Notes
(1) Tamb = 25 °C, unless otherwise specified.
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not
implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute maximum
ratings for extended periods of the time can adversely affect reliability.
(2) Refer to reflow profile for soldering conditions for surface mounted devices (SMD). Refer to wave profile for soldering conditions for through
hole devices (DIP).
Notes
(1) Tamb = 25 °C, unless otherwise specified.
Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering
evaluation. Typical values are for information only and are not part of the testing requirements.
(2) Tamb = 0 °Cto 70 °C, unless otherwise specified.
(3) To measure crosstalk, turn on the LED for channel 1 and the output current for channel 2 in logic high. Repeat for channel 2.
COUPLER
Isolation test voltage
t = 1.0 s
VISO
5300
VRMS
Pollution degree (DIN VDE 0109)
2
Creepage distance
≥ 7mm
Clearance distance
≥ 7mm
Derate linearly from 25 °C
1.93
mW/°C
Total package dissipation
Ptot
145
mW
Comparative tracking index per DIN
IEC112/VDE 0303 part 1, group IIIa per
DIN VDE 6110
175
Isolation resistance
VIO = 500 V, Tamb = 25 °C
RIO
≥ 1012
Ω
VIO = 500 V, Tamb = 100 °C
RIO
≥ 1011
Ω
Storage temperature range
Tstg
- 55 to + 125
°C
Ambient temperature range
Tamb
- 55 to +100
°C
Soldering temperature (2)
max. 10 s, dip soldering distance
to seating plane
≥ 1.5 mm
Tsld
260
°C
ELECTRICAL CHARACTERISTICS (1)
PARAMETER
TEST CONDITION
PART
SYMBOL
MIN.
TYP.
MAX.
UNIT
INPUT (2)
Forward voltage
IF = 16 mA
VF
1.6
1.9
V
Breakdown voltage
IR = 10 µs
VBR
4.5
V
Reverse current
VR = 4.5 V
IR
0.5
10
µA
Capacitance
VR = 0 V, f = 1.0 MHz
CO
125
pF
Temperature coefficient of
forward voltage
IF = 16 mA
ΔV
F/ΔTamb
- 1.7
mV/°C
OUTPUT
Logic low supply current
IF = 16 mA, VO = open, VCC = 4.5 V
ICCL
100
200
µA
Supply current, logic high
IF = 0 mA, VO = open, VCC = 15 V
ICCH
0.01
4.0
µA
Logic low output voltage
IF = 16 mA, VCC = 4.5 V, IO = 1.1 mA SFH6325
VOL
0.1
0.5
V
IF = 16 mA, VCC = 4.5 V, IO = 3.0 mA SFH6326
VOL
0.1
0.5
V
Logic high output current
IF = 0 mA, VO = VCC = 5.5 V
IOH
3.0
500
nA
IF = 0 mA, VO = VCC = 15 V
IOH
50
µA
Channel to channel (3) crosstalk
IF = 16 mA, VO = VCC = 5.5 V
IOH-XT
500
nA
COUPLER
Capacitance (input to output)
f = 1.0 MHz
CIO
0.6
pF
ABSOLUTE MAXIMUM RATINGS (1)
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT



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