TN805 datasheet(3/5 Pages) STMICROELECTRONICS

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102030 40506070 8090 100 110 120 130

Tcase(°C)

IT(av)(A)

D.C.

α = 180°

Fig. 3-1: Average and D.C. on-state current versus

case temperature.

1E-3

1E-2

1E-1

1E+0

0.1

0.2

0.5

1.0

tp(s)

K=[Zth(j-c)/Rth(j-c)]

Fig. 4-1: Relative variation of thermal impedance

versus pulse duration.

2345

IT(av)(A)

P(W)

D.C.

α = 30°

α = 60°

α = 90°

α = 120°

α = 180°

360°

Fig. 1: Maximum average power dissipation ver-

sus average on-state current .

102030405060 70 8090 100 110 120 130

Tamb(°C)

P(W)

Tcase (°C)

Rth=0°C/W

Rth=37°C/W

125

110

105

115

120

α = 180°

Fig. 2 : Correlation between maximum average

power dissipation and maximum allowable tem-

peratures (Tamb and Tcase) for different thermal

resistances heatsink+contact.

10203040 5060708090 100 110 120 130

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

Tamb(°C)

IT(av)(A)

D.C.

α = 180°

Fig. 3-2: Average and D.C. on-state current versus

case temperature.

1E-2

1E-1

1E+0

1E+1

1E+2

5E+2

0.01

0.10

1.00

tp(s)

K=[Zth(j-a)/Rth(j-a)]

Fig. 4-2: Relative variation of thermal impedance

versus pulse duration.

TN805/815-B

3/5

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