-40

-20

0

20406080

100

120

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

Tj(°C)

Igt,IH[Tj]/Ig,IH[Tj=25°C]

Igt

IH

Fig. 5: Relative variation of gate trigger current and

holding current versus junction temperature.

1

10

100

1000

0

10

20

30

40

50

60

70

80

Number of cycles

ITSM(A)

Tj initial=25°C

F=50Hz

Fig. 6: Non repetitive surge peak on-state current

versus number of cycles.

12

5

10

10

20

50

100

300

tp(ms)

ITSM(A),I²t(A²s)

Tj initial=25°C

ITSM

I²t

Fig. 7: Non repetitive surge peak on-state current

for a sinusoidal pulse with width tp<10ms, and cor-

responding value of I2t.

0

2

4

6

8

10

12

14

16

18

20

0

20

40

60

80

100

S(Cu) (cm²)

Rth(j-a) (°C/W)

Fig. 9: Thermal resistance junction to ambient ver-

sus copper surface under tab (Epoxy printed circuit

board FR4, copper thickness: 35

µm).

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

0.1

1.0

10.0

100.0

VTM(V)

ITM(A)

Tj max.:

Vto=0.85V

Rt=46m

Tj=Tj max.

Tj=25°C

Fig. 8: On-state characteristics (maximum values).

TN805/TN815-B

4/5