LTM4608A

23

4608afa

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However,noresponsibilityisassumedforitsuse.LinearTechnologyCorporationmakesnorepresenta-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTION

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994

2. ALL DIMENSIONS ARE IN MILLIMETERS

LAND DESIGNATION PER JESD MO-222

5. PRIMARY DATUM -Z- IS SEATING PLANE

6. THE TOTAL NUMBER OF PADS: 68

4

3

DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,

BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.

THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR

MARKED FEATURE

2.72 – 2.92

DETAIL B

DETAIL B

SUBSTRATE

MOLD

CAP

0.290 – 0.350

2.200 – 2.600

PACKAGE TOP VIEW

9.00

BSC

15.00

BSC

4

PAD “A1”

CORNER

X

Y

aaa Z

PACKAGE BOTTOM VIEW

3

PADS

SEE NOTES

DETAIL A

0.630 ±0.025 SQ. 68x

S

Y

X

eee

SUGGESTED PCB LAYOUT

TOP VIEW

LGA 68 1207 REV Ø

LTMXXXXXX

μModule

TRAY PIN 1

BEVEL

PACKAGE IN TRAY LOADING ORIENTATION

COMPONENT

PIN “A1”

DETAIL A

7.620

BSC

1.27

BSC

12.70

BSC

PAD 1

F

G

E

A

B

C

D

8

2

1

4

3

5

6

7

11

9

10

6.350

6.350

3.810

3.810

5.080

5.080

2.540

2.540

1.270

1.270

0.000

SYMBOL

aaa

bbb

eee

TOLERANCE

0.15

0.10

0.05

LGA Package

68-Lead (15mm × 9mm × 2.82mm)

(Reference LTC DWG # 05-08-1821 Rev Ø)