11

LTC2054/LTC2055

sn20545 20545fas

PACKAGE DESCRIPTIO

3.00 ±0.10

(4 SIDES)

NOTE:

1. DRAWING TO BE MADE A JEDEC PACKAGE

OUTLINE M0-229 VARIATION OF (WEED-1)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM

OF PACKAGE DO NOT INCLUDE MOLD FLASH.

MOLD FLASH, IF PRESENT, SHALL NOT EXCEED

0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1

LOCATION ON TOP AND BOTTOM OF PACKAGE

0.38 ± 0.10

BOTTOM VIEW—EXPOSED PAD

1.65 ± 0.10

(2 SIDES)

0.75 ±0.05

R = 0.115

TYP

2.38 ±0.10

(2 SIDES)

1

4

8

5

PIN 1

TOP MARK

(NOTE 6)

0.200 REF

0.00 – 0.05

(DD8) DFN 1203

0.25 ± 0.05

2.38 ±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

1.65 ±0.05

(2 SIDES)

2.15 ±0.05

0.50

BSC

0.675 ±0.05

3.5 ±0.05

PACKAGE

OUTLINE

0.25 ± 0.05

0.50 BSC

MSOP (MS8) 0603

0.53 ± 0.152

(.021 ± .006)

SEATING

PLANE

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH,

PROTRUSIONS OR GATE BURRS.MOLD FLASH,

PROTRUSIONS OR GATE BURRS SHALL NOT

EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH

OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS

SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING)

SHALL BE 0.102mm (.004") MAX

0.18

(.007)

0.254

(.010)

1.10

(.043)

MAX

0.22 – 0.38

(.009 – .015)

TYP

0.127 ± 0.076

(.005 ± .003)

0.86

(.034)

REF

0.65

(.0256)

BSC

0° – 6° TYP

DETAIL “A”

DETAIL “A”

GAUGE PLANE

12

3

4

4.90 ± 0.152

(.193 ± .006)

8

7 6 5

3.00 ± 0.102

(.118 ± .004)

(NOTE 3)

3.00 ± 0.102

(.118 ± .004)

(NOTE 4)

0.52

(.0205)

REF

5.23

(.206)

MIN

3.20 – 3.45

(.126 – .136)

0.889 ± 0.127

(.035 ± .005)

RECOMMENDED SOLDER PAD LAYOUT

0.42 ± 0.038

(.0165 ± .0015)

TYP

0.65

(.0256)

BSC

1.50 – 1.75

(NOTE 4)

2.60 – 3.00

0.25 – 0.50

TYP 5 PLCS

NOTE 3

DATUM ‘A’

0.09 – 0.20

(NOTE 3)

S5 SOT-23 0502

PIN ONE

2.80 – 3.10

(NOTE 4)

0.95 BSC

1.90 BSC

0.90 – 1.30

0.90 – 1.45

0.00 – 0.15

0.20 BSC

0.35 – 0.55 REF

NOTE:

1. DIMENSIONS ARE IN MILLIMETERS

2. DRAWING NOT TO SCALE

3. DIMENSIONS ARE INCLUSIVE OF PLATING

4. DIMENSIONS ARE EXCLUSIVE OF MOLD

FLASH AND METAL BURR

5. MOLD FLASH SHALL NOT EXCEED 0.254mm

6. PACKAGE EIAJ REFERENCE IS SC-74A (EIAJ)

ATTENTION: ORIGINAL SOT23-5L PACKAGE.

MOST SOT23-5L PRODUCTS CONVERTED TO THIN SOT23

PACKAGE, DRAWING # 05-08-1635 AFTER APPROXIMATELY

APRIL 2001 SHIP DATE

3.85 MAX

0.62

MAX

0.95

REF

RECOMMENDED SOLDER PAD LAYOUT

PER IPC CALCULATOR

1.4 MIN

2.62 REF

1.22 REF

MS8 Package

8-Lead Plastic MSOP

(Reference LTC DWG # 05-08-1660)

DD Package

8-Lead Plastic DFN (3mm × 3mm)

(Reference LTC DWG # 05-08-1698)

S5 Package

5-Lead Plastic TSOT-23

(Reference LTC DWG # 05-08-1635)

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.