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LTC2280 Datasheet(PDF) 18 Page - Linear Technology |
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LTC2280 Datasheet(HTML) 18 Page - Linear Technology |
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18 / 24 page ![]() LTC2280 18 2280fa APPLICATIO S I FOR ATIO Overflow Bit When OF outputs a logic high the converter is either overranged or underranged. Output Driver Power Separate output power and ground pins allow the output drivers to be isolated from the analog circuitry. The power supply for the digital output buffers, OVDD, should be tied to the same power supply as for the logic being driven. For example, if the converter is driving a DSP powered by a 1.8V supply, then OVDD should be tied to that same 1.8V supply. OVDD can be powered with any voltage from 500mV up to 3.6V. OGND can be powered with any voltage from GND up to 1V and must be less than OVDD. The logic outputs will swing between OGND and OVDD. Output Enable The outputs may be disabled with the output enable pin, OE. OE high disables all data outputs including OF. The data ac- cess and bus relinquish times are too slow to allow the outputs to be enabled and disabled during full speed op- eration. The output Hi-Z state is intended for use during long periods of inactivity. Channels A and B have independent output enable pins (OEA, OEB). Sleep and Nap Modes The converter may be placed in shutdown or nap modes to conserve power. Connecting SHDN to GND results in normal operation. Connecting SHDN to VDD and OE to VDD results in sleep mode, which powers down all circuitry including the reference and typically dissipates 1mW. When exiting sleep mode it will take milliseconds for the output data to become valid because the reference capacitors have Table 2. MODE Pin Function Clock Duty MODE Pin Output Format Cycle Stabilizer 0 Offset Binary Off 1/3VDD Offset Binary On 2/3VDD 2’s Complement On VDD 2’s Complement Off to recharge and stabilize. Connecting SHDN to VDD and OE to GND results in nap mode, which typically dissipates 30mW. In nap mode, the on-chip reference circuit is kept on, so that recovery from nap mode is faster than that from sleep mode, typically taking 100 clock cycles. In both sleep and nap modes, all digital outputs are disabled and enter the Hi-Z state. Channels A and B have independent SHDN pins (SHDNA, SHDNB). Channel A is controlled by SHDNA and OEA, and Channel B is controlled by SHDNB and OEB. The nap, sleep and output enable modes of the two channels are completely independent, so it is possible to have one channel operat- ing while the other channel is in nap or sleep mode. Digital Output Multiplexer The digital outputs of the LTC2280 can be multiplexed onto a single data bus if the sample rate is 80Msps or less. The MUX pin is a digital input that swaps the two data busses. If MUX is High, Channel A comes out on DA0-DA9, OFA; Channel B comes out on DB0-DB9, OFB. If MUX is Low, the output busses are swapped and Channel A comes out on DB0-DB9, OFB; Channel B comes out on DA0-DA9, OFA. To multiplex both channels onto a single output bus, con- nect MUX, CLKA and CLKB together (see the Timing Dia- gram for the multiplexed mode). The multiplexed data is available on either data bus—the unused data bus can be disabled with its OE pin. Grounding and Bypassing The LTC2280 requires a printed circuit board with a clean, unbroken ground plane. A multilayer board with an inter- nal ground plane is recommended. Layout for the printed circuit board should ensure that digital and analog signal lines are separated as much as possible. In particular, care should be taken not to run any digital track alongside an analog signal track or underneath the ADC. High quality ceramic bypass capacitors should be used at the VDD, OVDD, VCM, REFH, and REFL pins. Bypass capaci- tors must be located as close to the pins as possible. Of particular importance is the 0.1 µF capacitor between REFH and REFL. This capacitor should be placed as close to the device as possible (1.5mm or less). A size 0402 |
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