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SN74ACT8997NT Datasheet(PDF) 17 Page - Texas Instruments

Part # SN74ACT8997NT
Description  SCAN-PATH LINKERS WITH 4-BIT IDENTIFICATION BUSES SCAN-CONTROLLED IEEE STD 1149.1 JTAG TAP CONCATENATORS
PDF  28 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

SN74ACT8997NT Datasheet(HTML) 17 Page - Texas Instruments

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SN54ACT8997, SN74ACT8997
SCAN-PATH LINKERS WITH 4-BIT IDENTIFICATION BUSES
SCAN-CONTROLLED IEEE STD 1149.1 (JTAG) TAP CONCATENATORS
SCAS157D – APRIL 1990 – REVISED DECEMBER 1996
17
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
Table 9. Scan-Path Configurations
SR BIT
SSP CONFIGURATION
SCAN PATH CONFIGURATION†‡
7
5
3
1
SSP4
SSP3
SSP2
SSP1
SCAN-PATH CONFIGURATION†‡
0
0
0
0
Inactive
Inactive
Inactive
Inactive
TDI–SPL–TDO
0
0
0
1
Inactive
Inactive
Inactive
Active
TDI–(1)–SSP1–SPL–TDO
0
0
1
0
Inactive
Inactive
Active
Inactive
TDI–(1)–SSP2–SPL–TDO
0
0
1
1
Inactive
Inactive
Active
Active
TDI–(1)–SSP1–(1)–SSP2–SPL–TDO
0
1
0
0
Inactive
Active
Inactive
Inactive
TDI–(1)–SSP3–SPL–TDO
0
1
0
1
Inactive
Active
Inactive
Active
TDI–(1)–SSP1–(1)–SSP3–SPL–TDO
0
1
1
0
Inactive
Active
Active
Inactive
TDI–(1)–SSP2–(1)–SSP3–SPL–TDO
0
1
1
1
Inactive
Active
Active
Active
TDI–(1)–SSP1–(1)–SSP2–(1)–SSP3–SPL–TDO
1
0
0
0
Active
Inactive
Inactive
Inactive
TDI–(1)–SSP4–SPL–TDO
1
0
0
1
Active
Inactive
Inactive
Active
TDI–(1)–SSP1–(1)–SSP4–SPL–TDO
1
0
1
0
Active
Inactive
Active
Inactive
TDI–(1)–SSP2–(1)–SSP4–SPL–TDO
1
0
1
1
Active
Inactive
Active
Active
TDI–(1)–SSP1–(1)–SSP2–(1)–SSP4–SPL–TDO
1
1
0
0
Active
Active
Inactive
Inactive
TDI–(1)–SSP3–(1)–SSP4–SPL–TDO
1
1
0
1
Active
Active
Inactive
Active
TDI–(1)–SSP1–(1)–SSP3–(1)–SSP4–SPL–TDO
1
1
1
0
Active
Active
Active
Inactive
TDI–(1)–SSP2–(1)–SSP3–(1)–SSP4–SPL–TDO
1
1
1
1
Active
Active
Active
Active
TDI–(1)–SSP1–(1)–SSP2–(1)–SSP3–(1)–SSP4–SPL–TDO
† The scan-path configuration is the order of scan, beginning with the TDI of the ’ACT8997 and ending with the TDO of the ’ACT8997.
‡ A (1) indicates one bit of delay through the ’ACT8997. SPL indicates the selected scan register within the ’ACT8997.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)§
Supply voltage range, VCC
–0.5 V to 7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1)
–0.5 V to VCC + 0.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, VO (see Note 1)
–0.5 V to VCC + 0.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VCC)
±20 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VI < 0 or VI > VCC)
±20 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC)
±25 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum power dissipation at TA = 55°C (in still air) (see Note 2): DW package
1.7 W
. . . . . . . . . . . . . . . . . .
NT package
1.3 W
. . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg
–65
°C to 150°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
§ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150
°C and a board trace length of 750 mils,
except for the NT package, which has trace length of zero. For more information, refer to the
Package Thermal Considerations
application note in the
ABT Advanced BiCMOS Technology Data Book, literature number SCBD002.



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