EMP201

Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085

Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com

17.5 – 21.0 GHz Power Ammplifier MMIC

Issued Date: 12-18-03

ASSEMBLY DRAWING

The length of RF wires should be as short as possible. Use at least two wires between RF pad and 50

ohm line and separate the wires to minimize the mutual inductance.

CHIP OUTLINE

Chip Size 1000 x 2250 microns

Chip Thickness: 75

± 13 microns

PAD Dimensions: 100 x 100 microns

All Dimensions in Microns