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THS4031 Datasheet(PDF) 35 Page - Texas Instruments |
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THS4031 Datasheet(HTML) 35 Page - Texas Instruments |
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35 / 38 page ![]() THS4031, THS4032 100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS SLOS224C – JULY 1999 – REVISED APRIL 2000 35 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL INFORMATION DGN (S-PDSO-G8) PowerPAD ™ PLASTIC SMALL-OUTLINE PACKAGE 0,69 0,41 0,25 Thermal Pad (See Note D) 0,15 NOM Gage Plane 4073271/A 04/98 4,98 0,25 5 3,05 4,78 2,95 8 4 3,05 2,95 1 0,38 0,15 0,05 1,07 MAX Seating Plane 0,10 0,65 M 0,25 0 °–6° NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions include mold flash or protrusions. D. The package thermal performance may be enhanced by attaching an external heat sink to the thermal pad. This pad is electrically and thermally connected to the backside of the die and possibly selected leads. E. Falls within JEDEC MO-187 PowerPAD is a trademark of Texas Instruments. |
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