TL2218-285, TL2218-285Y

EXCALIBUR CURRENT-MODE SCSI TERMINATOR

SLVS072C – DECEMBER 1992 – REVISED OCTOBER 1995

POST OFFICE BOX 655303

8–3

functional block diagram (each channel)

Thermal

Regulation

Feedback

Active

Negation

Clamp

TERMPWR

1, 20

4

19

Vref

DISABLE

D0

Common to All Channels

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)

Continuous termination voltage

10 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous output voltage range

0 V to 5.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous disable voltage range

0 V to 5.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous total power dissipation

See Dissipation Rating Table

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

–55

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

–60

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

260

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

DISSIPATION RATING TABLE

PACKAGE

POWER RATING

T

≤ 25°C

DERATING FACTOR

T = 70

°C

T = 85

°C

T = 125

°C

PACKAGE

AT

POWER RATING

ABOVE T = 25

°C

POWER RATING

POWER RATING

POWER RATING

TA

828 mW

6.62 mW/

°C

530 mW

430 mW

166 mW

PW

TC

4032 mW

32.2 mW/

°C

2583 mW

2100 mW

812 mW

TL‡

2475 mW

19.8 mW/

°C

1584 mW

1287 mW

495 mW

‡ RθJL is the thermal resistance between the junction and device lead. To determine the virtual junction temperature (TJ) relative to the device lead

temperature, the following calculations should be used: TJ = PD x R

θJL + TL, where PD is the internal power dissipation of the device and TL is

the device lead temperature at the point of contact to the printed wiring board. R

θJL is 50.5°C/W.