TL2218-285, TL2218-285Y

EXCALIBUR CURRENT-MODE SCSI TERMINATOR

SLVS072C – DECEMBER 1992 – REVISED OCTOBER 1995

POST OFFICE BOX 655303

8–4

600

400

200

0

25

50

75

100

800

1000

1200

125

150

1800

1600

1400

2000

2200

2400

FREE-AIR TEMPERATURE

DISSIPATION DERATING CURVE

TA – Free-Air Temperature – °C

1200

800

400

0

25

50

75

100

1600

2000

2400

125

150

3600

3200

2800

4000

4400

4800

CASE TEMPERATURE

DISSIPATION DERATING CURVE

TC – Case Temperature – °C

R

θJA = 151°C/W

R

θJC = 31°C/W

Figure 1

Figure 2

1200

800

400

0

25

50

75

100

2000

125

150

3600

3200

2800

4000

4400

4800

LEAD TEMPERATURE

DISSIPATION DERATING CURVE

TL – Lead Temperature – °C

2400

1600

† RθJL = 50.5°C/W

Figure 3

† RθJL is the thermal resistance between the junction and device lead. To determine the virtual junction temperature (TJ) relative to the device lead

temperature, the following calculations should be used: TJ = PD x R

θJL + TL, where PD is the internal power dissipation of the device, and TL is

the device lead temperature at the point of contact to the printed wiring board. R

θJL is 50.5°C/W.