TPA0232

STEREO 2-W AUDIO POWER AMPLIFIER

WITH DC VOLUME CONTROL AND MUX CONTROL

SLOS286 – NOVEMBER 1999

29

POST OFFICE BOX 655303

MECHANICAL DATA

PWP (R-PDSO-G**)

PowerPAD

™ PLASTIC SMALL-OUTLINE PACKAGE

4073225/E 03/97

0,50

0,75

0,25

0,15 NOM

Thermal Pad

(See Note D)

Gage Plane

28

24

7,70

7,90

20

6,40

6,60

9,60

9,80

6,60

6,20

11

0,19

4,50

4,30

10

0,15

20

A

1

0,30

1,20 MAX

16

14

5,10

4,90

PINS **

4,90

5,10

DIM

A MIN

A MAX

0,05

Seating Plane

0,65

0,10

M

0,10

0

°–8°

20-PIN SHOWN

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusions.

D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This pad is electrically

and thermally connected to the backside of the die and terminals 1, 12, 13, and 24. The dimensions of the thermal pad are

2.40 mm

× 4.70 mm (maximum). The pad is centered on the bottom of the package.

E. Falls within JEDEC MO-153

PowerPAD is a trademark of Texas Instruments Incorporated.