TPA711

700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER

SLOS230B – NOVEMBER 1998 – REVISED MARCH 2000

2

POST OFFICE BOX 655303

AVAILABLE OPTIONS

PACKAGED DEVICES

MSOP

TA

SMALL OUTLINE†

(D)

MSOP‡

(DGN)

MSOP

SYMBOLIZATION

–40

°C to 85°C

TPA711D

TPA711DGN

ABB

† In the SOIC package, the maximum RMS output power is thermally limited to 350 mW; 700 mW

peaks can be driven, as long as the RMS value is less than 350 mW.

‡ The D and DGN packages are available taped and reeled. To order a taped and reeled part, add

the suffix R to the part number (e.g., TPA311DR).

Terminal Functions

TERMINAL

I/O

DESCRIPTION

NAME

NO.

I/O

DESCRIPTION

BYPASS

2

I

BYPASS is the tap to the voltage divider for internal mid-supply bias. This terminal should be connected to

a 0.1-

µF to 2.2-µF capacitor when used as an audio amplifier.

GND

7

GND is the ground connection.

IN

4

I

IN is the audio input terminal.

SE/BTL

3

I

When SE/BTL is held low, the TPA711 is in BTL mode. When SE/BTL is held high, the TPA711 is in SE mode.

SHUTDOWN

1

I

SHUTDOWN places the entire device in shutdown mode when held high (IDD = 7 µA).

VDD

6

VDD is the supply voltage terminal.

VO+

5

O

VO+ is the positive output for BTL and SE modes.

VO–

8

O

VO– is the negative output in BTL mode and a high-impedance output in SE mode.

6 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous total power dissipation

internally limited (see Dissipation Rating Table)

. . . . . . . . . . . . . . . . . . . . .

– 40

°C to 85°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

–40

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

–65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

260

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

§ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

DISSIPATION RATING TABLE

PACKAGE

TA ≤ 25°C

DERATING FACTOR

TA = 70°C

TA = 85°C

D

725 mW

5.8 mW/

°C

464 mW

377 mW

DGN

2.14 W¶

17.1 mW/

°C

1.37 W

1.11 W

¶ Please see the Texas Instruments document, PowerPAD Thermally Enhanced Package Application Report

(literature number SLMA002), for more information on the PowerPAD package. The thermal data was

measured on a PCB layout based on the information in the section entitled

Texas Instruments Recommended

Board for PowerPAD on page 33 of the before mentioned document.

recommended operating conditions

MIN

MAX

UNIT

Supply voltage, VDD

2.5

5.5

V

Operating free-air temperature, TA (see Table 3)

–40

85

°C