TPS2202, TPS2202Y

DUAL-SLOT PC CARD POWER-INTERFACE SWITCHES

FOR SERIAL PCMCIA CONTROLLERS

SLVS103A – DECEMBER 1994 – REVISED AUGUST 1995

6–3

POST OFFICE BOX 655303

TPS2202Y chip information

This chip, when properly assembled, displays characteristics similar to the TPS2202. Thermal compression or

ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with

conductive epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 MILS TYPICAL

BONDING PADS: 4

× 4 MILS MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%

ALL DIMENSIONS ARE IN MILS

TERMINALS 6, 14, 26, 27, 28, AND 29

ARE NOT CONNECTED

204

142

TPS2201Y

(2)

(28)

(1)

(3)

(29)

(30)

(27)

(4)

5V

5V

5V

DATA

CLOCK

NC

NC

NC

(6)

(5)

(7)

(8)

LATCH

NC

12V

AVPP

(10)

(9)

(11)

(12)

AVCC

AVCC

AVCC

GND

(14)

(13)

(15)

APWR_GOOD

NC

3V

(24)

(25)

(26)

(23)

NC

VDD

12V

BVPP

(20)

(21)

(22)

(19)

BVCC

BVCC

BVCC

BPWR_GOOD

(16)

(17)

(18)

OC

3V

3V

(2)

(1)

(3)

(4)

(5)

(7)

(8)

(10)

(9)

(11)

(12)

(13)

(15)

(20)

(21)

(22)

(19)

(16)

(17)

(18)

(30)

(24)

(25)

(23)