TPS7301Q, TPS7325Q, TPS7330Q, TPS7333Q, TPS7348Q, TPS7350Q

LOW-DROPOUT VOLTAGE REGULATORS

WITH INTEGRATED DELAYED RESET FUNCTION

SLVS124F – JUNE 1995 – REVISED JANUARY 1999

3

POST OFFICE BOX 655303

TPS73xxY chip information

These chips, when properly assembled, display characteristics similar to those of the TPS73xxQ. Thermal

compression or ultrasonic bonding may be used on the doped aluminum bonding pads. Chips may be mounted

with conductive epoxy or a gold-silicon preform.

(6)

(4)

(3)

(7)

(2)

(1)

GND

FB‡

OUT

RESET

IN

EN

TPS73xx

80

92

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

† SENSE – Fixed voltage options only (TPS7325, TPS7330,

TPS7333, TPS7348, and TPS7350)

‡ FB – Adjustable version only (TPS7301)

BONDING PAD ASSIGNMENTS

SENSE†

(5)

NOTE A. For most applications, OUT and SENSE should

be tied together as close as possible to the device;

for other implementations, refer to SENSE-pin

connection

discussion

in

the

applications

information section of this data sheet.

(3)

(4)

(5)

(6)

(7)

(2)

(1)

functional block diagram

¶

_

+

Vref

OUT

SENSE§/FB

EN

IN

GND

R1

R2

RESET

_

+

TPS7301

TPS7325

TPS7330

TPS7333

TPS7348

TPS7350

DEVICE

UNIT

R1

R2

0

260

358

420

726

756

∞

233

233

233

233

233

Ω

k

Ω

k

Ω

k

Ω

k

Ω

k

Ω

RESISTOR DIVIDER OPTIONS

§ For most applications, SENSE should be externally connected to OUT as close as possible to the device. For other implementations, refer to

SENSE-pin connection discussion in applications information section.

¶ Switch positions are shown with EN low (active).

NOTE A. Resistors are nominal values only.

Delayed

Reset

¶¶

MOS transistors

Bilpolar transistors

Diodes

Capacitors

Resistors

COMPONENT COUNT

464

41

4

17

76