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TPS65573DSST Datasheet(PDF) 2 Page - Texas Instruments |
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TPS65573DSST Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 13 page ![]() ABSOLUTE MAXIMUM RATINGS (1) RECOMMENDED OPERATING CONDITIONS DISSIPATION RATINGS TPS65573 SLVS868 – MARCH 2009................................................................................................................................................................................................... www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION TRANSPORT TA PACKAGE(1)(2) ORDERABLE PART NUMBER TOP-SIDE MARKING MEDIA, QUANTITY TPS65573DSST Tape and Reel, 250 –35°C to 85°C WSON CVR TPS65573DSSR Tape and Reel, 3000 (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. over operating free-air temperature range (unless otherwise noted) UNIT VCC –0.6 to 6 Supply voltage range V VBAT –0.6 to 13 VSW Switch terminal voltage range –0.6 to 50 V ISW Switch current between SW and GND 2 A VI Input voltage range CHG, I_PEAK, and F_ON –0.3 to VCC V Tstg Storage temperature range –40 to 150 °C TJ Maximum junction temperature 125 °C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. MIN MAX UNIT VCC 2.5 5.5 Supply voltage V VBAT 1.4 12 VSW Switch terminal voltage –0.3 45 V ISW Switch current between SW and GND 1.5 A Operating free-air temperature –35 85 °C VIH High-level digital input voltage at CHG and F_ON 1.5 V VIL Low-level digital input voltage at CHG and F_ON 0.5 V POWER RATINGS POWER RATINGS RATE PACKAGE RθJA (1) TA < 25°C TA = 85°C DFN 54.5°C/W 1.84 W 0.74 W (1) The thermal resistance, RθJA, is based on a soldered PowerPAD™ package on a 2S2P JEDEC board using thermal vias. 2 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS65573 |
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