SSL3250A_3

© NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 03 — 30 June 2009

20 of 26

NXP Semiconductors

SSL3250A

Photo flash dual LED driver

11. Thermal characteristics

[1]

The junction to ambient thermal resistance is dependent on the board layout, PCB material application, and environmental conditions.

12. Characteristics

Table 8.

Thermal characteristics

Symbol

Parameter

Conditions

Typ

Unit

thermal resistance from junction to ambient

Based on modeling on a four layer

board in free air and five thermal vias

under the IC.[1]

63

K/W

Table 9.

Characteristics

Symbol

Parameter

Conditions

Min

Typ[1]

Max

Unit

General voltage levels

input voltage

on pin VIN

3.0

-

5.5

V

extended input voltage on pin VIN

[2] 2.75

-

5.5

V

undervoltage lockout input voltage

2.55

2.65

2.8

V

undervoltage lockout hysteresis

voltage

50

100

150

mV

General current levels

shutdown current

Shut-down mode; ACT = 0

-

-

1

µA

leakage current on pin LX

ACT = 0

-

-

0.5

µA

peak current limiter current on

pin LX

Inductor peak current limiter

-

2.2

2.4

A

Output voltages on external resistor pins

voltage on pin R_IND

Independent of load

[3] 1.17

1.22

1.27

V

voltage on pin R_TR

Independent of load

[3] 1.17

1.22

1.27

V

voltage on pin R_FL

Independent of load

[3] 1.17

1.22

1.27

V

Allowed input voltages on external resistor pins

voltage on pin R_IND

[3] 1.4

-

V

voltage on pin R_TR

[3] 1.4

-

V

voltage on pin R_FL

[3] 1.4

-

V

External resistors

external resistance on pin R_IND

IF_SEL = 1; Resistors used

[3][4]

[5]

25

-

165

k

Ω

external resistance on pin R_TR

IF_SEL = 1; Resistors used

[3][4]

[5]

25

-

200

k

Ω

external resistance on pin R_FL

IF_SEL = 1 or 0;

Resistors used

[3][4]

[5]

50

-

357

k

Ω