SE97TP datasheet(46/54 Pages) NXP

Part #	SE97TP

Description	DDR memory module temp sensor with integrated SPD, 3.3 V

PDF	54 Pages

Scroll/Zoom	100%

Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

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46 / 54 page

SE97_5

Product data sheet

Rev. 05 — 6 August 2009

46 of 54

NXP Semiconductors

SE97

DDR memory module temp sensor with integrated SPD, 3.3 V

Fig 42. Package outline SOT1052-1 (HXSON8)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

SOT1052-1

MO-229

SOT1052-1

Note

1. Dimension A is including plating thickness. The package footprint is compatible with JEDEC MO229

DIMENSIONS (mm are the original dimensions)

HXSON8: plastic thermal enhanced extremely thin small outline package; no leads;

8 terminals; body 2 x 3 x 0.5 mm

UNIT

max

nom

min

0.5

0.04

2.1

2.0

1.9

1.6

1.4

0.5

3.1

3.0

2.9

1.6

1.4

0.45

0.35

0.3

0.2

0.1

0.05

A(1)

2 mm

scale

terminal 1

index area

1/2 e

terminal 1

index area

v M

detail X

×)

08-01-11

08-03-11

SE97TP Datasheet(PDF) 46 Page - NXP Semiconductors

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