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UCC5610 Datasheet(PDF) 2 Page - Texas Instruments |
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UCC5610 Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 5 page ![]() UCC5610 The power amplifier output stage allows the UCC5610 to source full termination current and sink active negation current when all termination lines are actively negated. The UCC5610 is pin for pin compatible with Unitrode’s other 18 line SCSI terminators, allowing lower capaci- tance and lower voltage upgrades to existing systems. The UCC5610, as with all Unitrode terminators, is com- pletely hot pluggable and appears as high impedance at the terminating channels with VTRMPWR = 0V or open. Internal circuit trimming is utilized, first to trim the 110 ohm termination impedance to a 7% tolerance, and then most importantly, to trim the output current to a 4% toler- ance, as close to the max SCSI-3 spec as possible, which maximizes noise margin in FAST-20 SCSI opera- tion. Other features include thermal shutdown and current limit. This device is offered in low thermal resistance versions of the industry standard 28 pin wide body SOIC, 24 pin wide body DIP and 28 pin PLCC. ABSOLUTE MAXIMUM RATINGS Termpwr Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7V Signal Line Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to +7V Regulator Output Current . . . . . . . . . . . . . . . . . . Self-regulating Storage Temperature . . . . . . . . . . . . . . . . . . . −65°C to +150°C Operating Temperature . . . . . . . . . . . . . . . . . −55°C to +150°C Lead Temperature (Soldering, 10 Sec.) . . . . . . . . . . . . . +300°C RECOMMENDED OPERATING CONDITIONS Termpwr Voltage . . . . . . . . . . . . . . . . . . . . . . . . 2.75V to 5.25V Signal Line Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to +5V Disconnect Input Voltage . . . . . . . . . . . . . . . . . . 0V to Termpwr Description Continued Unless otherwise specified all voltages are with respect to Ground. Currents are positive into, negative out of the speci- fied terminal. Consult Packaging Section of Unitrode Integrated Circuits dat- abook for thermal limitations and considerations of packages. CONNECTION DIAGRAMS PLCC-28 (Top View) QP Package * QP package pins 12 - 18 serve as both heatsink and signal ground. * DWP package pin 28 serves as signal ground; pins 7, 8, 9, 20, 21, 22 serve as heatsink/ground. SOIC-28 (Top View) DWP Package Note: Drawings are not to scale. DIL-24 (Top View) N or J Package 2 |
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