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TMC2192 Datasheet(PDF) 64 Page - Cadeka Microcircuits LLC. |
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TMC2192 Datasheet(HTML) 64 Page - Cadeka Microcircuits LLC. |
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64 / 69 page ![]() TMC2192 PRODUCT SPECIFICATION 64 REV. 1.0.0 8/13/03 Layout Considerations Designing with high-performance mixed-signal circuits demands printed circuits with ground planes. Wire-wrap is not an option. Overall system performance is strongly influ- enced by the board layout. Capacitive coupling from digital to analog circuits may result in poor picture quality. Con- sider the following suggestions when doing the layout: • Keep analog traces (CBYPx, VREF, RREF, DACx) as short and far from all digital signals as possible. The TMC2192 should be located near the board edge, close to the analog output connectors. • The power plane for the TMC2192 should be separate from that which supplies other digital circuitry. A single power plane should be used for all of the VDD pins. If the power supply for the TMC2192 is the same for the system's digital circuitry, power to the TMC2192 should be filtered with ferrite beads and 0.1 µF capacitors to reduce noise. • The ground plane should be solid, not cross-hatched. Connections to the ground plane should be very short. • Decoupling capacitors should be applied liberally to pins. For best results, use 0.1 µF capacitors. Lead lengths should be minimized. Ceramic chip capacitors are the best choice. • If there is dedicated digital power plane, it should not overlap the TMC2192 footprint, the voltage reference, or the analog outputs. Capacitive coupling of digital power supply noise from this layer to the TMC2192 and its related analog circuitry can have an adverse effect on performance. • The PXCK should be handled carefully. Jitter and noise on this clock or its ground reference will translate to noise on the video outputs. Terminate the clock line carefully to eliminate overshoot and ringing. • Connect all unused inputs to the TMC2192 to either ground or VDD. Do not leave them unconnected. |
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