MAX2247 datasheet(2/10 Pages) MAXIM

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2.4GHz SiGe Linear Power Amplifier

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ABSOLUTE MAXIMUM RATINGS

DC ELECTRICAL CHARACTERISTICS

(MAX2247 EV kit, VCC_ = +2.7V to +4.2V, SHDN = VCC, RF_IN and RF_OUT terminated to 50Ω, TA = -40°C to +85°C. Typical values

are at +3V and TA = +25°C, unless otherwise noted.) (Note 3)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

VCC1, VCC2, VCCB, RF_OUT to GND....................-0.3V to +4.5V

SHDN, BIAS, PD_OUT ................................-0.3V to VCC_ + 0.3V

RF Input Power (50Ω source)...........................................+5dBm

RF_IN Input Current............................................................±1mA

Maximum VSWR Without Damage ........................................10:1

Maximum VSWR for Stable Operation, POUT < +25dBm........5:1

Continuous Power Dissipation (TA = +70°C)

4 ✕ 3 UCSP, 12 WLP

(derate 28.5mW/°C above +70°C) ..................................1.3W

Thermal Resistance (Note 1)............................................35°C/W

Operating Temperature Range ...........................-40°C to +85°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +125°C

UCSP Bump Temperature (soldering) (Note 2)

Infrared (15s) ...............................................................+220°C

Vapor Phase (60s) .......................................................+215°C

WLP Bump Soldering Temperature .................................+250°C

Continuous Operating Lifetime.....................10yrs

× 0.92(TA - 60°C)

(For Operating Temperature, TA ≥ +60°C)

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage

2.7

4.2

POUT = +24dBm, VCC_ = 3.3V

317

350

POUT = +25dBm, VCC_ = 4.2V

345

Idle current = 250mA

with VCC = 3.3V

POUT = +23dBm, VCC_ = 3.0V

305

POUT = +21dBm with optimized output-matching circuit.

Refer to the MAX2247 EV kit for details.

175

POUT = +18dBm with optimized output-matching circuit.

Refer to the MAX2247 EV kit for details.

120

Supply Current (Notes 4, 5)

POUT = +15dBm with optimized output-matching circuit.

Refer to the MAX2247 EV kit for details.

Shutdown Supply Current

SHDN = 0, no RF signal applied

0.5

µA

Digital Input Logic High

Digital Input Logic Low

0.8

Digital Input Current High

-1

µA

Digital Input Current Low

-1

µA

CAUTION! ESD SENSITIVE DEVICE

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device

can be exposed to during board-level solder attach and rework. This limit permits the use of only the solder profiles recom-

mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.

Preheating is required. Hand or wave soldering is not recommended.

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