• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

4

Wide Band GaAs MMIC Amplifier

0.2 - 3.0 GHz

Rev. V4

MAAM02350

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Handling

Permanent damage to the MAAM02350 may occur

if the following precautions are not adhered to:

A. Cleanliness - The MAAM02350 should be

handled in a clean environment.

Do not

attempt

to

clean

assembly

after

the

MAAM02350 is installed.

B. Static Sensitivity - All die handling equipment

and personnel should comply with DOD-STD-

1686 Class 1.

C. Transients - Avoid instrument and power

supply transients while bias is connected to the

MAAM02350.

Use shielded signal and bias

cables to minimize inductive pick-up.

D. General Handling - DO NOT touch the surface

of the die.

It is recommended that the

MAAM02350 die be handled along the long

side with a sharp pair of tweezers.

Mounting

The MAAM02350 is back-metallized with Pd/Ni/Au

(100/1,000/30,000Å) metallization.

It can be die-

mounted using Au/Sn eutectic performs or a

thermally and electrically conductive epoxy.

The

attachment surface should be clean and flat.

Eutectic Die Attach:

A. An 80/20 Au/Sn perform is recommended with

a work surface temperature of approximately

225°C and a tool temperature of 265°C. When

hot 95/5 nitrogen/hydrogen gas is applied,

solder temperature should be approximately

290°C.

B. DO

NOT

expose

the

MAAM02350

to

a

temperature greater than 320°C for more than

20 seconds.

No more than 3 seconds of

scrubbing should be required for attachment.

Epoxy Die Attach:

A. Apply a minimum amount of epoxy and place

the MAAM02350 into position.

A thin epoxy

fillet should be visible around the perimeter of

the die.

B. Cure epoxy per manufacturer’s recommended

schedule.

Bonding

A. Ball or wedge bond with 1.0 mil diameter gold

wire or 3.0 mil x 0.5 mil ribbon. Thermosonic

bonding with a nominal stage temperature of

150°C and a ball bonding force of 40 to 50

grams or wedge bonding force of 18 to 22

grams is recommended. Ultrasonic energy and

time should be adjusted to the minimum levels

necessary to achieve reliable bonds.

B. Bonds should be started on the die and

terminated on the package. RF bonds should

be as short as possible; at least three and no

more than four bond wires from ground pads to

package are recommended.

C. Bonding pads are 4.0 x 4.0 mils.