• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

3

Surface Mount Low Power Step Recovery Diodes

Rev. V5

MA44700 Series

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Mounting Information

The illustration indicates the recommended mount-

ing pad configuration for the SOT-23 and SC-79

packages. Solder paste containing flux should be

screened onto the pads to a thickness of 0.005-

0.007 inches. The plastic package is placed in posi-

tion, firmly adhering to the solder paste.

Permanent attachment is performed by a reflow sol-

dering procedure during which the tab temperature

does not exceed +275

°C and the body temperature

does not exceed +250

°C, for standard models and

+260

°C for the RoHS compliant devices.

Please refer to Application Note M538 for surface

mounting instructions.

SC-79

0.020

0.50

0.053

1.35

inches

mm

Dimenstions:

0.020

0.50

0.75

1.9

.037

0.95

.035

0.90

.090

2.2

.030

0.80

inches

mm

Dimenstions:

min.

min.

SOT-23

Package Configuration

SOT-23 (Case Style 287)

SC-79 (Case Style 1279)