•

North America Tel: 800.366.2266 / Fax: 978.366.2266

•

Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

•

Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

6

RoHS Compliant

Rev. V1

GaAs PIN Diode Chips

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Die Handling and Mounting Information

Handling: All semiconductor chips should be handled with care to avoid damage or contamination

from perspiration, salts, and skin oils. The use of plastic tipped tweezers or vacuum pickups is

strongly recommended for individual components. Bulk handling should ensure that abrasion and

mechanical shock are minimized.

Die Attach Surface: Die can be mounted with an 80Au/Sn20, eutectic solder preform or electrically

conductive silver epoxy. The metal RF and D.C. ground plane mounting surface must be free of con-

tamination and should have a surface flatness of < ±0.002”.

recommended. When hot forming gas is applied, the work area temperature should be approximately

290

seconds.

Electrically Conductive Epoxy Die Attachment: A controlled amount of electrically conductive,

silver epoxy, approximately 1–2 mils in thickness, should be used to minimize ohmic and thermal

resistance. A thin epoxy fillet should be visible around the perimeter of the chip after placement to

ensure full area coverage. Cure conductive epoxy per manufacturer’s schedule. Typically 150°C for

1 hour.

Wire and Ribbon Bonding: It is recommended that thermo-compression or thermo-sonic bonding

be used with little or no ultrasonics. The bonding tool and wire or ribbon used should be smaller than

the anode contact diameter. A bonder heat stage temperature setting of 200

of 150°C and a force of 18 to 50 grams is suggested. If ultrasonic scrubbing is necessary it should be

adjusted to the minimum required to achieve a good bond. Excessive energy may cause the anode

metallization to separate from the chip.