MCP4131 datasheet(31/88 Pages) MICROCHIP

31 / 88 page

DS22060B-page 31

MCP413X/415X/423X/425X

3.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

Additional descriptions of the device pins follows.

TABLE 3-1:

PINOUT DESCRIPTION FOR THE MCP413X/415X/423X/425X

Weak

Pull-up/

down (2)

Standard Function

Single

Dual

Symbol

I/O

Buffer

Type

Rheo Pot (1) Rheo

Pot

10L

14L

16L

111

HV w/ST

“smart” SPI Chip Select Input

SCK

HV w/ST

“smart” SPI Clock Input

—

SDI

HV w/ST

“smart” SPI Serial Data Input

—

SDI/SDO

I/O

HV w/ST

“smart” SPI Serial Data Input/Output

(Note 1, Note 3)

444

3, 4

VSS

—

Ground

—

P1B

Analog

Potentiometer 1 Terminal B

—

P1W

Analog

Potentiometer 1 Wiper Terminal

—

P1A

Analog

Potentiometer 1 Terminal A

—

P0A

Analog

Potentiometer 0 Terminal A

P0W

Analog

Potentiometer 0 Wiper Terminal

P0B

Analog

Potentiometer 0 Terminal B

—

SHDN

HV w/ST

“smart” Hardware Shutdown

—

SDO

SPI Serial Data Out

VDD

—

Positive Power Supply Input

—

11,12 NC

—

No Connection

—

Exposed Pad (Note 4)

Legend:

HV w/ST = High Voltage tolerant input (with Schmidtt trigger input)

A = Analog pins (Potentiometer terminals)

I = digital input (high Z)

O = digital output

I/O = Input / Output

P = Power

Note 1: The 8-lead Single Potentiometer devices are pin limited so the SDO pin is multiplexed with the SDI pin

(SDI/SDO pin). After the Address/Command (first 6-bits) are received, If a valid Read command has been

requested, the SDO pin starts driving the requested read data onto the SDI/SDO pin.

2: The pin’s “smart” pull-up shuts off while the pin is forced low. This is done to reduce the standby and

shutdown current.

3: The SDO is an open drain output, which uses the internal “smart” pull-up. The SDI input data rate can be

at the maximum SPI frequency. the SDO output data rate will be limited by the “speed” of the pull-up,

customers can increase the rate with external pull-up resistors.

4: The DFN and QFN packages have a contact on the bottom of the package. This contact is conductively

connected to the die substrate, and therefore should be unconnected or connected to the same ground as

the device’s VSS pin.

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