MCP23018-ESLASHSS datasheet(53/56 Pages) MICROCHIP

53 / 56 page

DS22103A-page 53

MCP23018/MCP23S18

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office

Device

MCP23018:

16-Bit I/O Expander w/ I2C™ Inter-

face

MCP23018T:

16-Bit I/O Expander w/ I2C Interface

(Tape and Reel)

MCP23S18:

16-Bit I/O Expander w/ SPI Interface

MCP23S18T:

16-Bit I/O Expander w/ SPI Interface

(Tape and Reel)

Temperature

Range

E= -40

°C to +125°C (Extended) *

Package

= Plastic Quad Flat, No Lead Package

(4x4x0.9 mm Body), 24-Lead

= Skinny Plastic DIP (300 mil Body), 28-Lead

= Plastic SOIC (300 mil Body), 28-Lead

= SSOP, (209 mil Body, 5.30 mm), 24-Lead

PART NO.

/XX

Package

Temperature

Range

Device

Examples:

MCP23018-E/SP:

Extended Temp.,

28LD SPDIP package.

MCP23018-E/SO:

Extended Temp.,

28LD SOIC package.

MCP23018T-E/SO: Tape and Reel,

Extended Temp.,

28LD SOIC package.

MCP23018-E/SS:

Extended Temp.,

24LD SSOP package.

MCP23018T-E/SS: Tape and Reel,

Extended Temp.,

24LD SSOP package.

MCP23018-E/MJ:

Extended Temp.,

24LD QFN package.

MCP23S18-E/SP:

Extended Temp.,

28LD SPDIP package.

MCP23S18-E/SO:

Extended Temp.,

28LD SOIC package.

MCP23S18T-E/SO: Tape and Reel,

Extended Temp.,

28LD SOIC package.

MCP23S18T-E/MJ: Tape and Reel,

Extended Temp.,

24LD QFN package.

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MCP23018-E/SS Datasheet(PDF) 53 Page - Microchip Technology

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