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MPC8377ECVRALDA Datasheet(PDF) 87 Page - Freescale Semiconductor, Inc |
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MPC8377ECVRALDA Datasheet(HTML) 87 Page - Freescale Semiconductor, Inc |
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87 / 124 page  MPC8377E PowerQUICC™ II Pro Processor Hardware Specifications, Rev. 2 Freescale Semiconductor 87 Package and Pin Listings Figure 63 shows the mechanical dimensions and bottom surface nomenclature of the TEPBGA II package. Figure 63. Mechanical Dimensions and Bottom Surface Nomenclature of the TEPBGA II Note: 1 All dimensions are in millimeters. 2 Dimensioning and tolerancing per ASME Y14. 5M-1994. 3 Maximum solder ball diameter measured parallel to Datum A. 4 Datum A, the seating plane, is determined by the spherical crowns of the solder balls. 5 Parallelism measurement should exclude any effect of mark on top surface of package. 22.2 Pinout Listings Table 71 provides the pin-out listing for the TePBGA II package. Table 71. TePBGA II Pinout Listing Signal Package Pin Number Pin Type Power Supply Notes Clock Signals CLKIN K24 I OVDD — |
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