MX8771

IXYS

Parameter

Symbol

Min

Max

Unit

VPWR Supply Voltage

VPWR

62

V

Logic Supply Voltage

VCC

6

V

Input Pin Voltage

6

V

Continuous Output Current

20

mA

Storage Temperature

-55

150

C

o

Operating Ambient Temp

-40

85

C

o

Operating Junction Temp

150

C

o

Thermal Resistance

(Junction to Ambient)

110 Typical

C

Absolute

Maximum

Ratings

are

stress ratings. Stresses in excess of

these ratings can cause permanent

damage to the device. Functional

operation of the device at these or

any other conditions beyond those

indicated in the operational sections

of this data sheet is not implied.

Exposure

of

the

device

to

the

absolute maximum ratings for an

extended period may degrade the

device and affect its reliability.

ESD Warning

ESD (electrostatic discharge) sensitive device. Although the MX8771 features proprietary ESD protection circuitry,

permanent damage may be sustained if subjected to high energy electrostatic discharges. Proper ESD precautions

are recommended to avoid performance degradation or loss of functionality.

DC Electrical Characteristics

Parameter

Condition

Min

Typ

Max

Unit

Logic Supply Voltage

1.65

5.5

V

Quiescent Logic Supply Current

Inputs = 0 or VCC

1

µA

VPWR Voltage

6

60

V

VPWR Current

Total of all outputs

240

mA

GND Current

Total of all outputs

240

mA

Quiescent VPWR Current

VPWR = 42V, No load

350

uA

High Level Input Voltage

SDA, SCL, OE

0.7VCC

V

Low Level Input Voltage

0.3VCC

V

Input Leakage Current

1

µA

Input hysteresis voltage

0.1VCC

V

Output Low voltage, 3 mA sink

SDA, VCC > 2

0.4

V

VCC < 2

0.2VCC

Out0-15 Current

Any one output, sink or source

15

mA

Out0-15 ON Resistance

VPWR = 42V

45

Ω

Out0-15 Tri-State Leakage

OE = Logic Low

1

µA

Notes:

To avoid unwanted output during VPWR application and system initialization, either reset the

device (RSTN logic low) or maintain OE logic low until the registers are initialized by I2C control.

Thermal Resistance is measured in still air with the device soldered to a 6 square inch board

without a ground plane. Applications may require derating of the specified maximum currents to

avoid exceeding the maximum operation junction temperature.

MX8771

2

3/6/08

Drawing No. 877109

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