Copyright

© ANPEC Electronics Corp.

Rev. A.2 - Nov., 2009

APL3208A/B/C

www.anpec.com.tw

2

Ordering and Marking Information

Symbol

Parameter

Rating

Unit

ACIN Input Voltage (ACIN to GND)

-0.3 ~ 30

V

CHG_DET to GND Voltage

-0.3 ~ 7

V

CHG_SW to GND Voltage

V

VBAT to GND Voltage

-0.3 ~ 7

V

OUT to GND Voltage

-0.3 ~ 7

V

OUT Output Current

1.5

A

Maximum Junction Temperature

150

Storage Temperature

-65 ~ 150

Maximum Lead Soldering Temperature, 10 Seconds

260

Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Symbol

Parameter

Typical Value

Unit

θ

JA

Junction-to-Ambient Resistance in Free Air

(Note 2)

TDFN2x2-8

TSOT-23-6A

80

235

Thermal Characteristics

Note 2:

θ

of TDFN2x2-8 is soldered directly on the PCB.

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which

are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for

MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen

free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by

weight).

APL3208A

APL3208B

APL3208C

Handling Code

Temperature Range

Package Code

X - Date Code

Assembly Material

APL3208A

QB:

L08A

X

X - Date Code

APL3208B

QB:

L08B

X

X - Date Code

APL3208C

QB:

L08C

X

Package Code

QB : TDFN2x2-8

CT : TSOT-23-6A

Operating Ambient Temperature Range

Handling Code

TR : Tape & Reel

Assembly Material

G : Halogen and Lead Free Device

X - Date Code

APL3208A

CT:

L8AX

X - Date Code

APL3208B

CT:

L8BX

X - Date Code

APL3208C

CT:

L8CX