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LPC2362 Datasheet(PDF) 53 Page - NXP Semiconductors

Part # LPC2362
Description  Single-chip 16-bit/32-bit MCU; up to 128 kB flash with ISP/IAP, Ethernet, USB 2.0 device/host/OTG, CAN, and 10-bit ADC/DAC
PDF  57 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

LPC2362 Datasheet(HTML) 53 Page - NXP Semiconductors

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LPC2361_62_4
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 04 — 4 March 2010
53 of 57
NXP Semiconductors
LPC2361/62
Single-chip 16-bit/32-bit MCU
16. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
LPC2361_62_4
20100304
Product data sheet
-
LPC2361_62_3
Modifications:
• Table 3 “Pin description”: Added table note for XTAL1 and XTAL2 pins.
• Table 4 “Limiting values”: Changed VESD min/max to −2500/+2500.
• Table 5 “Static characteristics”: Updated min, typical and max values for oscillator pins.
• Table 5 “Static characteristics”: Added table note for ZDRV.
• Table 5 “Static characteristics”: Updated conditions and typical values for
IDD(DCDC)dpd(3V3), IBATact, and IBAT.
• Table 6 “Dynamic characteristics”: Added ARM processor clock frequency information.
• Added Table 8 “Dynamic characteristics of flash”.
• Added Table 10 “DAC electrical characteristics”.
• Section 7.2 “On-chip flash programming memory”: Removed text regarding flash
endurance minimum specs.
• Added Section 7.23.4.4 “Deep power-down mode”.
• Section 7.24.2 “Brownout detection”: Changed VDD(3V3) to VDD(DCDC)(3V3).
• Added Section 9.1 “Power-down mode”.
• Added Section 9.2 “Deep power-down mode”.
• Added Section 13.2 “XTAL1 input”.
• Added Section 13.3 “XTAL and RTC Printed Circuit Board (PCB) layout guidelines”.
• Figure 13 “ADC characteristics”: Changed VDDA to Vi(VREF).
LPC2361_62_3
20081111
Product data sheet
-
LPC2361_62_2
Modifications:
• Figure 3: corrected memory map.
LPC2361_62_2
20081016
Product data sheet
-
LPC2361_62_1
Modifications:
• Clarify Ethernet availability between devices throughout data sheet.
• Section 2 and Section 7.3: clarify SRAM size difference between devices.
• Table 2: add table note to clarify Ethernet SRAM usage, changed orientation from
landscape to portrait.
• Table 5: removed table note “Includes external resistors...”.
• Table 5: removed row Rpu.
• Table 5: VI, added Table note 6.
• Table 5: Vhys, moved 0.4 from Typ to Min column.
• Table 5: IOHS, IOLS, updated Table note 8.
• Figure 6: removed figure note row “VDD = 1.8 V”.
LPC2361_62_1
20080804
Product data sheet
-
-



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