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BA3404F Datasheet(PDF) 21 Page - Rohm |
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BA3404F Datasheet(HTML) 21 Page - Rohm |
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21 / 25 page ![]() Technical Note BA10358F/FV,BA10324AF/FV,BA2904SF/FV/FVM,BA2904F/FV/FVM,BA2904HFVM-C, BA2902SF/FV/KN,BA2902F/FV/KN,BA3404F/FVM 21/24 www.rohm.com 2009.05 - Rev.A © 2009 ROHM Co., Ltd. All rights reserved. ● Derating curves Power dissipation(total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature). IC is heated when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and thermal resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame of the package. The parameter which indicatesthis heat dissipation capability(hardness of heat release)is called thermal resistance, represented by the symbol θja[℃/W].The temperature of IC inside the package can be estimated by this thermal resistance. Fig.124(a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient temperature Ta, junction temperature Tj, and power dissipation Pd can be calculated by the equation below: θja = (Tj-Ta) / Pd [℃/W] ・・・・・ (Ⅰ) Derating curve in Fig.124(b) indicates power that can be consumed by IC with reference to ambient temperature.Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient iis determined by thermal resistance θja. Thermal resistance θja depends on chip size, power consumption, package,ambient temperature, package condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Fig.125(a)~(d) show a derating curve for an example of BA10358, BA10324A, BA2904S, BA2904, BA2904HFVM-C, BA3404, BA2902S, BA2902. When using the unit above Ta=25[℃], subtract the value above per degree[℃]. Permissible dissipation is the value when FR4 glass epoxy board 70[mm]×70[mm]×1.6[mm](cooper foil area below 3[%]) is mounted. ( *9) ( *10) ( *11) ( *12) ( *13) ( *14) ( *15) ( *16) ( *17) ( *18) Unit 6.2 5.5 7.0 4.9 6.2 5.5 4.8 7.0 5.3 4.9 [mW/℃] (a) Thermal resistance (b) Derating curve Fig. 124 Thermal resistance and derating curve Fig. 125 Derating curve 0 50 75 100 125 150 25 P1 P2 Pd (max) LSIの消費電力 [W] θ' ja2 θ' ja1 Tj ' (max) θja2 < θja1 周囲 温度 Ta [℃ ] θ ja2 θ ja1 Tj (max) Ambient temperature Power dissipation of LSI 周囲温度 Ta [℃] チップ 表面温度 Tj [℃] 消費電力 P [W] θja = ( Tj ーTa ) / Pd [℃/W] Ambient temperature Chip surface temperature Power dissipation 0 200 400 600 800 1000 0 25 50 75 100 125 周囲温度 Ta [℃] BA10358F BA10358FV 620mW (*1) 550mW (*2) (a) BA10358 ファミリ 0 200 400 600 800 1000 0 25 50 75 100 125 周囲温度 Ta [℃] BA10324AFV BA10324AF 700mW (*3) 490mW (*4) (a) BA10324A ファミリ 0 200 400 600 800 1000 0 25 50 75 100 125 150 周囲温度 Ta [℃] BA2904F BA3404F BA2904FV BA2904FVM BA3404FVM 780mW( *5) 690mW( *6) 590mW (*7) BA3404F BA3404FVM (a) BA2904 ファミリ 0 200 400 600 800 1000 0 25 50 75 100 125 150 周囲温度 Ta [℃] BA2902FV BA2902KN BA2902F 870mW( *8) 660mW( *9) 610mW (*10) (a) BA2902 ファミリ (d)BA2902S/BA2902 family Ambient temperature :Ta [℃] 550mW(*10) 620mW(*9) 700mW(*11) 490mW(*12) 870mW(*16) 660mW(*17) 610mW(*18) BA2902SFV BA2902SKN BA2902SF 105 105 (b) Ambient temperature :Ta [℃] Ambient temperature :Ta [℃] (a)BA10358 family (b)BA10324A family 0 200 400 600 800 1000 0 255075 100 125 150 AMBIENT TEMPERATURE [℃] BA2904F BA2904FV BA2904FVM BA2904HFVM-C BA2904SFV BA2904SFVM 105 BA2904SF 690mW(*14) 780mW(*13) 590mW(*15) BA3404F BA3404FVM Ambient temperature :Ta [℃] (c)BA2904S/BA2904/BA3404 family,BA2904H 50 400 200 800 600 0 1000 25 75 100 125 150 0 |
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