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ARF477FL Datasheet(PDF) 3 Page - Microsemi Corporation |
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ARF477FL Datasheet(HTML) 3 Page - Microsemi Corporation |
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3 / 4 page ![]() ARF477FL Figure 5b, TRANSIENT THERMAL IMPEDANCE MODEL 0 0.05 0.10 0.15 0.20 0.25 10-5 10-4 10-3 10-2 10 1.0 -1 0.3 D = 0.9 SINGLE PULSE RECTANGULAR PULSE DURATION (SECONDS) Figure 5a, Maximum Effective Transient Thermal Impedance, Junction-To-Case vs Pulse Duration 0.5 0.1 0.05 Peak TJ = PDM x ZθJC + TC Duty Factor D = t1/t 2 t2 t1 Note: 0.7 Dissipated Power (Watts) T J (˚C) T C (˚C) Z EXT are the external thermal impedances: Case to sink, sink to ambient, etc. Set to zero when modeling only the case to junction. .0915 .108 .0111F .133F Freq. (MHz) Z in (Ω)ZOUT (Ω) 40 60 80 1.5 - j 10 1.9 - j 1.3 2.2 - j 0.82 24 - j 37 13 - j 29 7.9 - j 24 Z IN - Gate shunted with 100Ω I dq = 0 Z OL - Conjugate of optimum load for 400 Watts output at Vdd=125V |
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