ARF477FL

1.500

.300

.200

.005

.040

ARF477FL

.175

.175

.325

.325 +/- .010

.570

1.250

.320

.125dia

4 pls

.125R

4 pls

.080

1.000

HAZARDOUS MATERIAL WARNING

The white ceramic portion of the device between leads

and mounting surface is beryllium oxide, BeO. Beryllium

oxide dust is toxic when inhaled. Care must be taken dur-

ing handling and mounting to avoid damage to this area.

These devices must never be thrown away with general

industrial or domestic waste.

Thermal Considerations and Package Mounting:

The rated power dissipation is only available when the package

mounting surface is at 25°C and the junction temperature is 175°C.

The thermal resistance between junctions and case mounting sur-

face is 0.23 °C/W. When installed, an additional thermal impe-

dance of 0.07°C/W between the package base and the mounting

surface is typical. Insure that the mounting surface is smooth and

flat. Thermal joint compound must be used to reduce the effects of

small surface irregularities. Use the minimum amount necessary to

coat the surface. The heatsink should incorporate a copper heat

spreader to obtain best results.

The package design clamps the ceramic base to the heatsink. A

clamped joint maintains the required mounting pressure while al-

lowing for thermal expansion of both the base and the heat sink.

Four 4-40 (M3) screws provide the required mounting force. T = 6

in-lb (0.68 N-m).

Microsemi’s products are covered by one or more of U.S. patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583

4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 6,939,743, 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262

and foreign patents. US and Foreign patents pending. All Rights Reserved.

65MHz Test Circuit