HAZARDOUS MATERIAL WARNING

The ceramic portion of the

device between

leads and mounting surface is beryllium oxide,

BeO.

Beryllium oxide dust is toxic when in-

haled.

Care must be taken during handling

and mounting to avoid damage to this area

These devices must never be thrown away

with general industrial or domestic waste.

Heat Sink

D

S

S

G

S

S

D

G

S

S

S

S

ARF15--

BeO

1525-xx

.005

.045

.250

.500

.500

1.065

.207

.207

.375

.105 typ.

D

S

G

Thermal Considerations and Package

Mounting:

The rated 1500W power dissipation is only avail-

able when the package mounting surface is at

25

°C and the junction temperature is 200°C. The

thermal resistance between junctions and case

mounting surface is 0.12

°C/W. When installed, an

additional thermal impedance of 0.1

°C/W between

the package base and the mounting surface is typi-

cal. Insure that the mounting surface is smooth

and flat. Thermal joint compound must be used to

reduce the effects of small surface irregularities.

The heatsink should incorporate a copper heat

spreader to obtain best results.

The package is designed to be clamped to a

heatsink. A clamped joint maintains the required

mounting pressure while allowing for thermal ex-

pansion of both the device and the heat sink. A

simple clamp, and two 6-32 (M3.5) screws can pro-

vide the minimum 125lb required mounting force.

T = 12 in-lb.

Table 1 - Typical Class AB Large Signal Impedance -- ARF1501

F (MHz)

2.0

13.5

27

40

10.6 -j 12.2

0.5 -j 2.7

0.22 -j 0.8

0.2 +j .12

31 -j 4.7

15.6 -j 16

6.2 -j 12.6

3.1 -j 9.4

Z

output at Vdd = 250V

ARF1501

0.14

0.12

0.10

0.08

0.06

0.04

0.02

0

0.5

0.1

0.3

0.7

D = 0.9

0.05

SINGLE PULSE

T

Figure 4, Typical Threshold Voltage vs Temperature

V

Figure 5, Typical Output Characteristics

1.15

1.10

1.05

1.00

0.95

0.90

0.85

0.80

0.75

-50 -25

0

25

50

75

100 125 150

0

5

10

15

20

25

30

8V

5V

6V

7V

45

40

35

30

25

20

15

10

5

0

9V

10V

1.0

RECTANGULAR PULSE DURATION (SECONDS)

Figure 6, Maximum Effective Transient Thermal Impedance, Junction-to-Case vs. Pulse Duration

Peak TJ = PDM x ZθJC + TC

Duty Factor D =

2

t2

t1

Note: