NX2154ACSTR datasheet(14/17 Pages) MICROSEMI

14 / 17 page

NX2154/2154A

Rev.1.2

02/26/07

nected to the GND plane with multiple vias. One is not

enough. This is very important. The same applies to the

output capacitors and input capacitors.

6. Hdrv and Ldrv pins should be as close to

MOSFET gate as possible. The gate traces should be

wide and short. A place for gate drv resistors is needed

to fine tune noise if needed.

7. Vcc capacitor, BST capacitor or any other by-

passing capacitor needs to be placed first around the IC

and as close as possible. The capacitor on comp to

GND or comp back to FB needs to be place as close to

the pin as well as resistor divider.

8. The output sense line which is sensing output

back to the resistor divider should not go through high

frequency signals.

9. All GNDs need to go directly thru via to GND

plane.

10. The feedback part of the system should be

kept away from the inductor and other noise sources,

and be placed close to the IC.

11. In multilayer PCB, separate power ground and

analog ground. These two grounds must be connected

together on the PC board layout at a single point. The

goal is to localize the high current path to a separate

loop that does not interfere with the more sensitive ana-

log control function.

Figure 9 - High output current application of 2154

+1.8V,20A

Vout

2 x 16SP180M

2 x (1500uF,13mohm)

Gnd

Ldrv

Hdrv

Comp

BST

Vcc

1uF

Cin

Vin

+12V

D1 MBR0530T1

M1 IRF3706

2 x IRF3706

L1 1uH

15nF

0.1uF

800

Vin

+5V

220pF

L2 1uH

33uF

HI=SD

C7 4.7nF

TYPICAL APPLICATION FOR HIGH CURRENT

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