WM8729

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WOLFSON MICROELECTRONICS LTD

PP Rev 1.2 April 2001

15

PACKAGE DRAWING

NOTES:

A. ALL LINEAR DIMENSIONS ARE IN MILLIMETERS (INCHES).

B. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.

C. BODY DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSION, NOT TO EXCEED 0.25MM (0.010IN).

D. MEETS JEDEC.95 MS-012, VARIATION = AC. REFER TO THIS SPECIFICATION FOR FURTHER DETAILS.

Symbols

Dimensions

(mm)

Dimensions

(Inches)

MIN

MAX

MIN

MAX

A

1.35

1.75

0.0532

0.0688

A1

0.10

0.25

0.0040

0.0098

B

0.33

0.51

0.0130

0.0200

C

0.19

0.25

0.0075

0.0098

D

9.80

10.00

0.3859

0.3937

E

3.80

4.00

0.1497

0.1574

e

1.27 BSC

0.05 BSC

H

5.80

6.20

0.2284

0.2440

h

0.25

0.50

0.0099

0.0196

L

0.40

1.27

0.0160

0.0500

α

0

o

8

o

0

o

8

o

REF:

JEDEC.95, MS-012

DM012.B

D: 16 PIN SOIC 3.9mm Body

L

C

α

0.10 (0.004)

SEATING PLANE

A

A1

-C-

E

H

B

9

16

e

8

1

D