74HC4067 datasheet(2/29 Pages) NXP

2 / 29 page

74HC_HCT4067_3

Product data sheet

Rev. 03 — 15 October 2007

2 of 29

NXP Semiconductors

74HC4067; 74HCT4067

16-channel analog multiplexer/demultiplexer

Ordering information

Table 1.

Ordering information

Type number

Package

Temperature range

Name

Description

Version

74HC4067

74HC4067N

−40 °C to +125 °C

DIP24

plastic dual in-line package; 24 leads (600 mil);

reverse bending

SOT101-1

74HC4067D

−40 °C to +125 °C

SO24

plastic small outline package; 24 leads;

body width 7.5 mm

SOT137-1

74HC4067DB

−40 °C to +125 °C

SSOP24

plastic shrink small outline package; 24 leads;

body width 5.3 mm

SOT340-1

74HC4067PW

−40 °C to +125 °C

TSSOP24

plastic thin shrink small outline package; 24 leads;

body width 4.4 mm

SOT355-1

74HC4067BQ

−40 °C to +125 °C

DHVQFN24 plastic dual in-line compatible thermal enhanced very

thin quad ﬂat package; no leads; 24 terminals;

body 3.5

× 5.5 × 0.85 mm

SOT815-1

74HCT4067

74HCT4067N

−40 °C to +125 °C

DIP24

plastic dual in-line package; 24 leads (600 mil);

reverse bending

SOT101-1

74HCT4067D

−40 °C to +125 °C

SO24

plastic small outline package; 24 leads;

body width 7.5 mm

SOT137-1

74HCT4067DB

−40 °C to +125 °C

SSOP24

plastic shrink small outline package; 24 leads;

body width 5.3 mm

SOT340-1

74HCT4067PW

−40 °C to +125 °C

TSSOP24

plastic thin shrink small outline package; 24 leads;

body width 4.4 mm

SOT355-1

74HCT4067BQ

−40 °C to +125 °C

DHVQFN24 plastic dual in-line compatible thermal enhanced very

thin quad ﬂat package; no leads; 24 terminals;

body 3.5

× 5.5 × 0.85 mm

SOT815-1

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