AM1806 datasheet(238/241 Pages) TI

238 / 241 page

AM1806

SPRS658B – FEBRUARY 2010 – REVISED MAY 2010

www.ti.com

8.2

Thermal Data for ZCE Package

The following table(s) show the thermal resistance characteristics for the PBGA–ZCE mechanical

package.

Table 8-1. Thermal Resistance Characteristics (PBGA Package) [ZCE]

NO.

°C/W(1)

AIR FLOW (m/s)(2)

ΘJC

Junction-to-case

7.6

N/A

ΘJB

Junction-to-board

11.3

N /A

ΘJA

Junction-to-free air

23.9

0.00

21.2

0.50

20.3

1.00

ΘJMA

Junction-to-moving air

19.5

2.00

18.6

4.00

0.2

0.00

0.3

0.50

PsiJT

Junction-to-package top

0.3

1.00

0.4

2.00

0.5

4.00

11.2

0.00

11.1

0.50

PsiJB

Junction-to-board

11.1

1.00

11.0

2.00

10.9

4.00

(1)

These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application.

For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment

Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount

Packages. Power dissipation of 500 mW and ambient temp of 70C assumed. PCB with 2oz (70um) top and bottom copper thickness

and 1.5oz (50um) inner copper thickness

(2)

m/s = meters per second

238

Mechanical Packaging and Orderable Information

Submit Documentation Feedback

Product Folder Link(s): AM1806

AM1806 Datasheet(PDF) 238 Page - Texas Instruments

AM1806 Datasheet(HTML) 238 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datasheet Download

Link URL