AM1806 datasheet(239/241 Pages) TI

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AM1806

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SPRS658B – FEBRUARY 2010 – REVISED MAY 2010

8.3

Thermal Data for ZWT Package

The following table(s) show the thermal resistance characteristics for the PBGA–ZWT mechanical

package.

Table 8-2. Thermal Resistance Characteristics (PBGA Package) [ZWT]

NO.

°C/W(1)

AIR FLOW (m/s)(2)

ΘJC

Junction-to-case

7.3

N/A

ΘJB

Junction-to-board

12.4

N /A

ΘJA

Junction-to-free air

23.7

0.00

21.0

0.50

20.1

1.00

ΘJMA

Junction-to-moving air

19.3

2.00

18.4

4.00

0.2

0.00

0.3

0.50

PsiJT

Junction-to-package top

0.3

1.00

0.4

2.00

0.5

4.00

12.3

0.00

12.2

0.50

PsiJB

Junction-to-board

12.1

1.00

12.0

2.00

11.9

4.00

(1)

These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application.

For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment

Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount

Packages. Power dissipation of 1W and ambient temp of 70C assumed. PCB with 2oz (70um) top and bottom copper thickness and

1.5oz (50um) inner copper thickness

(2)

m/s = meters per second

Mechanical Packaging and Orderable Information

239

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