100

Ch_In

Ch_Out

GND

TPD6F002

SLLS876A – AUGUST 2008 – REVISED NOVEMBER 2009

www.ti.com

ORDERING INFORMATION

ORDERABLE

PACKAGE DIMENSION

TOP-SIDE MARKING

PART NUMBER

Length = 3 mm, Width = 1.35 mm,

–40°C to 85°C

0.5-mm pitch SON – DSV

TPD6F002DSVR

YM3NS

Pitch = 0.5 mm, Height = 0.75 mm)

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

EQUIVALENT SCHEMATIC REPRESENTATION

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

IO to GND

6

V

Storage temperature range

–65

150

°C

Junction temperature

150

°C

Lead temperature (soldering, 10 s)

300

°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the

specifications is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.

ELECTRICAL CHARACTERISTICS

PARAMETER

TEST CONDITIONS

MIN

MAX

UNIT

DC breakdown voltage

6

V

R

Resistance

85

100

115

Ω

C

Capacitance (C1 or C2)

17

pF

Channel leakage current

1

20

nA

Cut-off frequency

100

MHz

(1)

ESD PROTECTION

PARAMETER

TYP

UNIT

HBM

±15

kV

IEC 61000-4-2 Contact Discharge

±20

kV

IEC 61000-4-2 Air-Gap Discharge

±30

kV

2

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