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BAW56 Datasheet(PDF) 10 Page - NXP Semiconductors |
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BAW56 Datasheet(HTML) 10 Page - NXP Semiconductors |
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10 / 15 page ![]() BAV756S_BAW56_SER_5 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 05 — 26 November 2007 10 of 15 NXP Semiconductors BAV756S; BAW56 series High-speed switching diodes Fig 13. Wave soldering footprint BAW56 (SOT23/TO-236AB) Reflow soldering is the only recommended soldering method. Fig 14. Reflow soldering footprint BAW56M (SOT883/SC-101) sot023 4.00 4.60 2.80 4.50 1.20 3.40 3 21 1.20 (2x) preferred transport direction during soldering Dimensions in mm solder resist occupied area solder lands solder lands solder paste solder resist occupied area Dimensions in mm 1.30 0.30 R = 0.05 (12 ×) R = 0.05 (12 ×) 0.60 0.70 0.80 0.90 0.30 (2 ×) 0.35 (2 ×) 0.20 0.40 (2 ×) 0.50 (2 ×) 0.25 (2 ×) 0.30 0.40 0.50 |
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