Table R5 - Physical Characteristics and Environmental Specifications for Radial-leaded Devices

Cont'd

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RTEF

Physical Characteristics

Lead material

Soldering characteristics

Solderability pre ANSI/J-STD-002 Category 3

Solder heat withstand

per IEC-STD 68-2-20, Test Tb, Method 1a, condition b; can withstand 10 seconds at 260°C ±5°C

Insulting material

Cured, flame-retardant epoxy polymer; meets UL 94V-0

RTEF

Environmental Specifications

Test

Conditions

Resistance Change

Passive aging

70°C, 1000 hours

±5%

85°C, 1000 hours

±5%

Humidity aging

85°C, 85%RH, 1000 hours

±5%

Thermal Shock

85°C, -40°C (10 times)

±5%

Solvent resistance

MIL-STD-202, Method 215F

No change

RUEF

Physical Characteristics

Lead material

Soldering characteristics

Solderability pre ANSI/J-STD-002 Category 3

Solder heat withstand

per IEC-STD 68-2-20, Test Tb, Method1a, condition b, can withstand 10 seconds at 260°C ±5°C

Insulting material

Cured, flame-retardant epoxy polymer; meets UL 94V-0

Devices are not designed to be placed through a reflow process.

RUEF

Environmental Specifications

Test

Conditions

Resistance Change

Passive aging

70°C, 1000 hours

±5%

85°C, 1000 hours

±5%

Humidity aging

85°C, 85%RH, 1000 hours

±5%

Thermal Shock

85°C, -40°C (10times)

±5%

Solvent resistance

MIL-STD-202, Method 215F

No change

RUSBF

Physical Characteristics

Lead material

Soldering characteristics

Solderability pre ANSI/J-STD-002 Category 3 except

RUSBF075 meet ANSI/J-STD-002 Category 1

Solder heat withstand

RUSBF120: per IEC-STD 68-2-20, Test Tb, Method 1a, condition a; can withstand 5 seconds at 260°C ±5°C

All others: per IEC-STD 68-2-20, Test Tb, Method 1a, condition b; can withstand 10 seconds at 260°C ±5°C

Insulting material

Cured, flame-retardant epoxy polymer; meets UL 94V-0

Devices are not designed to be placed through a reflow process.

RUSBF

Environmental Specifications

Test

Conditions

Resistance Change

Passive aging

70°C, 1000 hours

±5%

85°C, 1000 hours

±5%

Humidity aging

85°C, 85%RH, 1000 hours

±5%

Thermal Shock

85°C, -40°C (10 times)

±5%

Solvent resistance

MIL-STD-202, Method 215F

No change

RGEF

Physical Characteristics

Lead material

Soldering characteristics

Solderability pre ANSI/J-STD-002 Category 3

Solder heat withstand

RGEF300K and RGEF400: per IEC 68-2-20, Test Tb, Method 1a, condition a; can withstand 5 seconds at 260°C ±5°C

RGEF500 to RGEF1400: per IEC 68-2-20, Test Tb, Method 1a, condition b; can withstand 10 seconds at 260°C ±5°C

Insulting material

Cured, flame-retardant epoxy polymer; meets UL 94V-0

Devices are not designed to be placed through a reflow process.

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