199

RoHS Compliant, ELV Compliant

10

Terminal material

Tin-plated brass, Nickel under-plating

Soldering characteristics

EIC 60008-2-58

Test

Conditions

Passive aging

60°C, 1000 hours

85°C, 1000 hours

Humidity aging

85°C, 85% RH, 500 hours

Thermal shock

125°C, -55°C (10 times)

Solvent resistance

MIL-STD-202, Method 215F

Note: Storage conditions: 40°C max., 70% RH max., devices should remain in original sealed bag prior to use. Devices may not meet specified values if these storage conditions are exceeded.

TS250/TSV250/TSL250*

Physical Characteristics

Environmental Specifications

‡ Excluding TRF600-150 and TRF600-400, which have a coating that is not rated for dielectric withstand and can withstand 500h at 85°C/85% RH or 1000h at 60°C/90% RH.

Lead material

Tin-plated copper, 22AWG

Insulating material

Flammability

per IEC 695-2-2 Needle flame test for 20s

Soldering characteristics

ANSI/J-STD-002, Category 3

Solder heat withstand

IEC-STD 68-2-20, Test Tb, Section 5 Method 1A, Condition B: can withstand 10 seconds at 260°C±5°C

Note: Devices are not designed to be placed through a reflow process.

TRF600†

Physical Characteristics

Test

Conditions

Passive aging

60°C, 1000 hours

85°C, 1000 hours

Humidity aging

Thermal shock

125°C, -55°C (10 times)

Solvent resistance

MIL-STD-202, Method 215F

Note: Storage conditions: 40°C max., 70% RH max., devices should remain in original sealed bag prior to use. Devices may not meet specified values if these storage conditions are exceeded.

Environmental Specifications

Operating temperature range for all listed products is -40°C to 85°C, except for TRF250-080T and TRF250-184 (0°C to 85°C)

Table T5

Physical Characteristics and Environmental Specifications for

Telecommunications and Networking Devices

Cont’d

Lead material

Tin-plated copper, 22AWG

Insulating material

Cured epoxy polymer

Flammability

per IEC 695-2-2 Needle Flame Test for 20s

Soldering characteristics

ANSI/J-STD-002, Category 3

Solder heat withstand

IEC-STD 68-2-20, Test Tb, Section 5 Method 1A, Condition B: can withstand 10 seconds at 260°C±5°C

Note: Devices are not designed to be placed through a reflow process.

Test

Conditions

Passive aging

60°C, 1000 hours

85°C, 1000 hours

Humidity aging

85°C, 85% RH, 1000 hours

Thermal shock

125°C, -55°C (10 times)

Solvent resistance

MIL-STD-202, Method 215F

Note: Storage conditions: 40°C max., 70% RH max., devices should remain in original sealed bag prior to use. Devices may not meet specified values if these storage conditions are exceeded.

TRF250*

Physical Characteristics

Environmental Specifications