LTC6255/LTC6256/LTC6257



625567f

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However,noresponsibilityisassumedforitsuse.LinearTechnologyCorporationmakesnorepresenta-

tionthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.

pAckAge Description

MSPackage

16-LeadPlasticMSOP

(ReferenceLTCDWG#05-08-1669RevØ)

MSOP (MS16) 1107 REV Ø

0.53 0.152

(.021 .006)

SEATING

PLANE

0.18

(.007)

1.10

(.043)

MAX

0.17 –0.27

(.007 – .011)

TYP

0.86

(.034)

REF

0.50

(.0197)

BSC

16151413121110

1 2 3 4 5 6 7 8

9

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

0.254

(.010)

0 – 6 TYP

DETAIL “A”

DETAIL “A”

GAUGE PLANE

5.23

(.206)

MIN

3.20 – 3.45

(.126 – .136)

0.889 0.127

(.035 .005)

RECOMMENDED SOLDER PAD LAYOUT

0.305 0.038

(.0120 .0015)

TYP

0.50

(.0197)

BSC

4.039 0.102

(.159 .004)

(NOTE 3)

0.1016 0.0508

(.004 .002)

3.00 0.102

(.118 .004)

(NOTE 4)

0.280 0.076

(.011 .003)

REF

4.90 0.152

(.193 .006)