BeRex

BD25B

http: //www.berex.com

Quadruple Band 2-Way SMT Power Divider

1700~2500MHz USPCS & PCS, WCDMA & TD-SCDMA, WiBro

Device Features and Description

 23dB Typical Isolation

 0.5dB Typical Insertion Loss

 Small Size and Low Profile

 MSL 1 moisture rating

 Lead-free/Green/RoHS compliant package

Application: commercial, space, military wireless system

 Industry Standard SOIC-8 SMT Plastic Package with exposed back side ground pad

 Chip is fully passivated for enhanced performance and reliability

 Can be used without back side ground soldering

(This may degrade the performance at the high frequency edge. Refer to the following

typical test data)

Electrical specifications

Parameters

Unit

Min

Typ

Max

Frequency Range

MHz

1700

2500

Insertion Loss

dB

0.5

0.8

Isolation

dB

15

23

IRL(S11)

dB

-20

-15

ORL(S22,S33)

dB

-23

-15

Amplitude Balance

dB

0.05

0.2

Phase Balance

deg

1.0

2.0

All specifications apply with the following test conditions,

1.

Device performance is measured on BeRex evaluation board at 25C, 50 ohm system

2.

Insertion Loss: Above 3.0dB

3.

Back side ground was soldered

Absolute Maximum Ratings

Parameters

Rating

Input Power

1W CW

Storage Temperature

-55 to +155C

Operating Temperature

-40C to +85C

Operation of this device above any of these parameters may result in permanent damage.

Function Block Diagram